|
| Extension tube adjusts snowflake
size |
| Removal of particles from 0.0005"
diameter gold bonding wires with Sno-Gun |
 |
 |
| Circuit before cleaning. Note contamination. |
Circuit after cleaning. All contamination
removed. |
|
| See below
for information on a CO2 Purifier and Micro
Precision Steam Cleaner. |
| CO2 Consumption: |
36 lbs./hr. under continuous duty. |
| Shipping Case Dimensions: |
13"W x 18"L x 5.5"H |
| Shipping Weight: |
9 lbs. |
|
The SNO GUN™ II High Precision Cleaner
- Safely removes contaminants—including fingerprints,
light hydrocarbon residue, and submicron particles—using
dry ice snow
- More effective than nitrogen at cleaning wafers, chips,
optics, and other particle-sensitive components
- Safe for use with microcircuit wires or energized electronic
components
- Portable, easy-aim design and adjustable nozzles provide
broad or very localized cleaning of hard-to-reach surfaces
- Environmentally friendly operation eliminates the need
for solvent disposal—contaminants are carried away
in a stream of inert CO2
- Low operating cost: CO2 is inexpensive and
readily available
The SNO GUN™ II provides a safe, inexpensive, highly
effective alternative to solvent or dry nitrogen cleaning
of semiconductor components, PC boards, and other sensitive
parts.
Removes Surface Contaminants as Small
as 0.1 Micron
Dry ice particles generated by the SNO GUN™ II penetrate
the boundary layer immediately adjacent to the surface. Contaminants
that are untouched by nitrogen guns are dislodged and carried
away in the flowing stream. Light organic contamination may
be removed by the localized solvent effect created when dry
ice particles impinge on a surface.
The SNO GUN™ II cleaning process does not scratch delicate
semiconductor or precision optical surfaces. Even the finest
wires in microcircuitry remain undisturbed. CO2
is non-conductive, allowing electronic components to be safely
cleaned even while energized.
The hand-held SNO GUN™ II is transportable to wherever
cleaning is required. Simply attach the SNO GUN™ II to
a CO2 cylinder and start cleaning more effectively.
Complete Line of Features to Meet
Every Application
The SNO GUN™ II comes with interchangeable nozzles with
9 standard combinations. By changing the nozzle configurations,
you can adjust the spray pattern, size, and force of the dry
ice particles. Micro-particles can be generated in the <
1mm diameter range with a velocity from 150 fps to 1000 fps
that produce an aggressive dry ice storm capable of removing
light oils, light greases, and hydrocarbons. Fingerprints
can be removed from many surfaces. Three extension tubes provide
larger, more gentle snowfall capable of cleaning unadhered
particles down to .1 micron without disturbing delicate substrates.
The SNO GUN™ II includes a .5-micron filter inside the
valve for point-of-use filtration, a Teflon-jacketed nozzle
design that minimizes condensation, a 10' flexible hose (for
connection to a standard gas cylinder), and hard plastic storage
case.
|
Cat.
# |
$/Each |
| SNO
GUN™ ll |
4545-00A |
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|
|
The SNO GUN™ II provides safe, effective,
economical cleaning in a wide range of critical applications.
Silicone Wafers—The
speedy cleaning process effectively removes contaminants
as small as .1 microns from wafer surfaces. Versatile
tip configurations allow adjustment of force and pattern
of dry ice spray to ensure safe cleaning. Select Terra's
DryClean™ Glove Box to prevent moisture condensation.
Hybrid Circuits—Short
blasts of dry ice snow typically remove all particles
from hard-to-reach recesses in hybrid packages without
disturbing delicate wire bonds. Applying and slowing
heating Methyl Alcohol to its boiling point and then
re-spraying the area with dry ice snow can remove stains.
Disk Drives—The
SNO GUN™ II safely removes particles from disk
heads, drive cavities, and magnetic media itself. Automated
configurations can be installed for continuous operation
on assembly lines.
|
Flat Panel Displays—The SNO GUN™
II is ideal for removal of particles, fingerprints,
and other light residues on FPD substrates and glass
prior to coating.
Optics—From
a 400-inch telescope mirror to 20-mm by 20-mm photoelectric
cells, CO2 cleaning removes dust particles
and light hydrocarbon contamination without surface
pitting.
Medical Devices—Cardiac
and ophthalmic shunts are cleaned to a precision level.
Medical tools and instruments have dust, light oils,
and fingerprints removed.
Micro-mechanical
assemblies and other precision parts—Removes
dust and deposits from gyroscopes and microvalving components.
Ideal for difficult to reach areas (threads, orifices).
PC Boards—By altering the nozzle configuration,
you can pinpoint highly localized contaminants or remove
fingerprints and other residues from larger surface
areas.
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